Rayson RS70B64G4S16G: Version: eMMC 5.1 Capacity: 64GB Model: RS70B64G4S16G Minimum Order Quantity: 1520 units Samsung KLMCG2UCTB-B041: Version: eMMC 5.1 Capacity: 64GB Voltage: 1.8 / 3.3 V Interface: HS400 Package Size: 11.5 x 13 x 0.8 mm …
Rayson RS70B64G4S16G can serve as a substitute for Samsung KLMCG2UCTB-B041 eMMC 5.1 Read More »
USB 3.0 Flash Drive 32GB/64GB/128GB/256GB metal Housing: Lucky (Metal) Controller: PS2251-19 Flash: Good Die – TLC Sequential Performance: 220/100 MB/s Interface: USB 3.2 Gen 1 Connecter Type: Type A, Type C, Type A + Micro-B, Type A + Type C Bridge: N/A Temperature Range: 0°C ~ 70°C Agent of Phison controller, SATA SSD Pcle SSD …
Phison has launched a series of cutting-edge storage devices, led by the outstanding PS5026-E26 Max14um SSD. This state-of-the-art solid-state drive (SSD) harnesses the PCIe 5.0 interface and refined firmware to deliver breathtaking sequential read speeds of up to 14.7 GB/s and write speeds reaching 12 GB/s. The integration of Micron 3D TLC NAND chips further …
Rayson eMMC5.1 Part Number: RS70B32G4S15G Density: 32 GB NAND Flash Type: 256Gb x 1 User Density (MB): 29,824 Package Size (mm): 11.5x13x1.0 Pin Configuration: 153 TFBGA Samsung eMMC5.1 Part Number: KLMBG2JENB-B041 Version: eMMC 5.1 Density: 32 GB Voltage: 1.8 / 3.3 V Interface: HS400 Package Size: 11.5 x 13 x 1.0 mm Temperature: -25 ~ …
Rayson RS70B32G4S15G can replace Samsung KLMBG2JENB-B041 eMMC5.1 with a capacity of 32GB Read More »
RAYSON RS70B16G4S10F can replace SAMSUNG KLMAG1JENB-B041, eMMC 5.1, and is also 16GB. Product: eMMC 5.1 Capacity: 16GB Model: RS70B16G4S10F Minimum packaging: 1520 Temperature: -25~85 ℃ Product: eMMC 5.1 Capacity: 16 GB Model: KLMAG1JENB-B041 Voltage: 1.8/3.3 V Interface: HS400 Size: 11.5 x 13 x 0.8 mm Temperature: -25~85 ° C Related applications, tablets, smart TVs, mobile …
RAYSON RS70B16G4S10F can replace SAMSUNG KLMAG1JENB-B041 eMMC 5.1 Read More »
RAYSON RS70B08G3S03F can replace KLM8G1GEME-B041, and the packaging size is almost the same, but different temperatures need to be noted. Product type: eMMC Product model: RS70B08G3S03F Version: 5.1 Storage capacity: 8GB NAND FLASH type: 2D MLC Continuous read/write (up to): 160/110 MB/s Package type: 153 Balls Package size: 11.5 x 13 x 0.92 Operating temperature: …
RAYSON RS70B08G3S03F replaces KLM8G1GEME-B041 eMMC 5.1 Read More »
Phison Electronics (8299TT) is a leading provider of NAND controllers and NAND storage solutions. Recently, the company announced a comprehensive range of UFS (Universal Flash Storage) controllers, including the PS8325, PS8327, PS8329, and PS8361. Phison’s new UFS solutions support a broad spectrum of smartphones, from entry-level to flagship models, aiming to deliver peak mobile storage …
Phison Introduces Comprehensive Lineup of UFS Storage Solutions Read More »
Ingenic T21 has been discontinued, and Ingenic has launched T31/T40/T41. Let me briefly introduce it to you. We are Ingenic’s agent, providing technical support and stable supply. Welcome to inquire. Ingenic T31 Universal Balanced (H.265+AI) Video Processor Starlight Enhanced ISP support 5M@30fps HEVC video encoding, ultra-low bitrate Can quickly implement lightweight AI algorithms More advanced …
Ingenic T21 has been discontinued, and Ingenic has launched T31/T40/T41 Read More »
PHISON has announced the launch of an SSD storage solution specifically designed for recording and monitoring systems, including mid to high end S12DI and cost-effective S17T SSDs. According to data from market research institutions, there are approximately 35 million shipments of video and surveillance systems worldwide each year. With the increasing demand for high-resolution recording, …
In the semiconductor industry, the suffix of chip models often represents the differences between them. As a leading global semiconductor manufacturer, Winbond also offers a variety of chip series to meet different needs. Indisina will analyze in detail the differences between the “G” and “Q” suffixes in Winbond chip models and explore novel application scenarios. …
The difference and application exploration between Winbond chip suffixes G and Q Read More »
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