| Grade | cost performance | Medium to high order | Higher order | Higher order | Flagship |
| Product | eMMC | UFS | UFS | PCle | PCle |
| Interface | 5.0/5.1 | 2.1 /2.2 | 3.1 | PCle Gen.3×2 | PCle Gen.4×4 PCle Gen.4×2 |
| Reference application | Smart home, mobile/tablet, monitoring, loT, TV, STB, Networking | Mid to high end smartphones/tablets AR/VR, AI Intelligence | Advanced 5G mobile phone/tablet AR/VR, AI intelligence | Advanced 5G mobile phone/tablet AR/VR, AI intelligence Edge operation | Flagship 5G mobile phone/tablet AR/VR, AI intelligence Edge operation |
| Capacity | 4GB to 256GB | 32GB to 256GB | 128GB to 512GB | 64GB to 512GB | 256GB to 1024GB |
| Operating temperature | -25℃~85℃ | -25℃~85℃ | -25℃~85℃ | 0℃~70℃ | 0℃~70℃ |
| Continuous read and write performance (highest) | 315/240 | 1040/910 | 1900/1420 | 1730/1400 | G4x4 5,000/3,900 G4x2 3,700/3,100 |
| Dimension | 11.5*13mm, BGA 153ball | 11.5*13mm, BGA 153ball | 11.5*13mm, BGA 153ball | 11.5*13mm, BGA 345ball | 11.5*13mm, BGA 345ball |
What is the function of Winbond?
2024-11-11
Winbond is a specialized memory IC company that designs, develops, manufactures, and markets memory solutions. It offers a range of products including Code Storage Flash
