There are multiple options for phison 512gb nvme ssd. We provide you with the following parameters. Different options have different prices. We will also provide you with technical support. Welcome to consult.
Embedded PCIe Gen4 SSD Solutions
| Product | M.2 2280-D2-M | M.2 2280-S2-M |
| Interface | Gen 4×4 NVMe1.4 | Gen 4×4 NVMe1.4 |
| DRAM | DDR4 | DDR4-less |
| Flash memory combination architecture | X4 3D TLC NAND Flash Double side | X4 3D TLC NAND Flash Double side |
| Main feature | • Advanced PCIe Gen4 SSD • Ultra-high density PCIe SSD for data logging or edge computing storage | • High-end DRAM-less SSD with Gen4 high performance and low power consumption, suitable for read or entry-level mixed workload systems |
| Capacity | 480GB ~ 3840GB | 256GB ~ 2048GB |
| Efficient | Seq. with SLC cache : 7200/6500 MB/s4 Seq. without SLC cache : 6800/2400 MB/s5 | Seq. with SLC cache : 3600/3000 MB/s4 Seq. without SLC cache : 3200/1500 MB/s5 |
| 4KB random performance | Ran. with SLC cache : 750K/1000K IOPS4 Ran. without SLC cache : 600K/300K IOPS5 | Ran. with SLC cache : 600K/310K IOPS4 Ran. without SLC cache : 350K/180K IOPS5 |
| Heat transfer sensing | Yes | Yes |
| Security encryption protection | TCG OPAL | TCG OPAL |
| HW PLP Circuit | X | X |
| Operating temperature | 0~70℃ to -40~85℃ | 0~70℃ to -40~85℃ |
Embedded PCIe Gen3 SSD Solutions (1/2)
| Produce | U.2 | M.2 22110-D2-M | M.2 2280-D2-M |
| Interface | Gen3x4 NVMe1.3 | Gen3x4 NVMe1.3 | Gen3x4 NVMe1.3 |
| DRAM | DDR4 | DDR4 | DDR4 |
| Flash memory combination architecture | X8/16 NAND Flash | X8 3D TLC NAND Flash | X4 3D TLC NAND Flash |
| Main feature | • Outstanding stable performance and low latency • Equipped with power failure protection mechanism to protect critical data during unexpected power failures | • Ultra-large capacity PCIe SSD, suitable for endpoint computing devices | • Advanced and high-end PCIe SSDs • M.2 modules for mixed-workload devices |
| Capacitance | 240GB ~ 15360GB | 3840GB | 240GB ~ 1920GB |
| Efficacy | Burst Seq. 3200/3000 MB/s4 Sustained Seq.3200/1000 MB/s (Default) | Burst Seq. 3200/2800 MB/s Sustained Seq. 3200/850 MB/s | Burst Seq. 3200/3000 MB/s Sustained Seq.3000/1000 MB/s |
| Heat transfer sensing | Yes | Yes | Yes |
| Security encryption protection | TCG OPAL | TCG OPAL | TCG OPAL |
| HW PLP Circuit | Support | X | X |
| Operating temperature | 0~70℃ ~ -40~85℃ | 0~70℃ to -40~85℃ | 0~70℃ to -40~85℃ |
Embedded PCIe Gen3 SSD Solutions (2/2)
| Produce | M.2 2280-S2-M | M.2 2242-D2-M | M.2 2242-D2-B-M |
| Interface | Gen3x4 NVMe1.3 | Gen3x4 NVMe1.3 | Gen3x2 NVMe1.3 |
| DRAM | DRAM-Less | DRAM-Less | DRAM-Less |
| Flash memory combination architecture | X4 3D TLC NAND Flash Single side | X4 3D TLC NAND Flash Double side | X4 3D TLC NAND Flash Double side |
| Main feature | • Mainstream memory-free PCIe SSD for embedded systems • Ideal for read-intensive drives • All-round SSD with competitive and cost-effective performance | • Mainstream memory-free PCIe SSD for embedded systems • Ideal for read-intensive drives • All-round SSD with competitive and cost-effective performance | • Mainstream memory-free PCIe SSD for embedded systems • Ideal for read-intensive drives • All-round SSD with competitive and cost-effective performance |
| Capacitance | 128GB ~ 2048GB | 128GB ~ 2048GB | 128GB ~ 2048GB |
| Efficacy | 2500/1900 MB/s4 | 2500/1900 MB/s4 | 1750/1600 MB/s4 |
| Heat transfer sensing | Yes | Yes | Yes |
| Security encryption protection | TCG OPAL | TCG OPAL | TCG OPAL |
| Operating temperature | 0~70℃ to -40~85℃ | 0~70℃ to -40~85℃ | 0~70℃ to -40~85℃ |
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