Winbond’s W25Q128JVSIQ is a 128Mbit Serial Flash Memory with uniform 4KB sectors and Dual/Quad SPI, designed to provide a storage solution for systems with limited space, pins, and power. This SPI Flash memory is part of the SpiFlash® series and is manufactured by Winbond Electronics, offering a range of features that make it suitable for various applications, including code shadowing into RAM, executing code directly from dual/quad SPI (XIP), and storing voice, text, and data.
**Key Features:**
1. **Memory Organization:** The W25Q128JVSIQ is organized into 65536 programmable pages, each 256 bytes, allowing for page programming of up to 256 bytes at a time.
2. **Erase Capabilities:** Pages can be erased in groups of 16 (4KB sector erase), 128 (32KB block erase), 256 (64KB block erase), or the entire chip can be erased at once (chip erase).
3. **Interface:** It supports standard Serial Peripheral Interface (SPI), Dual I/O SPI, and Quad I/O SPI, with a maximum SPI clock frequency of 133MHz, allowing for equivalent clock rates of 266MHz (dual I/O) and 532MHz (quad I/O) when using fast read dual/quad I/O instructions.
4. **Performance:** The device offers a continuous data transfer rate of up to 66MB/s and has a minimum of 100K program/erase cycles for each sector, ensuring long-term reliability and endurance.
5. **Power Efficiency:** Operated with a single 2.7V to 3.6V power supply and featuring a low power shutdown current of <1µA (typical value), making it suitable for power-sensitive applications.
6. **Temperature Range:** The W25Q128JVSIQ is designed to operate within a wide temperature range of -40°C to +85°C, with additional options for -40°C to +105°C and -40°C to +125°C.
7. **Security Features:** It includes advanced security features such as software and hardware write protection, power-on lock, special OTP (One-Time Programmable) protection, top/bottom and complementary array protection, individual block/sector array protection, a 64-bit unique ID for each device, and 3×256-byte security registers with OTP lock.
8. **Package Options:** The W25Q128JVSIQ is available in various space-efficient packages, including SOIC-8 208mil, SOIC16 300mil, and WSON 6x5mm.
For detailed specifications and electrical characteristics, you can refer to the Winbond 25Q128JVSIQ datasheet. This document provides comprehensive information on the device’s operation, including pin configurations, timing diagrams, and electrical parameters.
This Winbond chip is lead-free and complies with the Restriction of Hazardous Substances Directive (RoHS) requirements, making it an environmentally friendly choice for electronic components. With its high performance, flexibility, and reliability, the W25Q128JVSIQ is an excellent choice for a wide range of applications in the automotive, industrial, and consumer electronics sectors. For more in-depth information, always consult the Winbond 25Q128JVSIQ datasheet.
