RS512M32LO4D1BDS-53BT Rayson 2GB LPDDR4X LPDDR4 Mobile DRAM Memory Rayson Electronic Parts Distributor

Product Overview:

• Ultra-low-voltage core and I/O power supplies: VDD1 = 1.70-1.95V (nominal 1.80V), VDD2 = 1.06-1.17V (nominal 1.10V), VDDQ = 0.57-0.65V (nominal 0.60V) or VDDQ = 1.06-1.17V (nominal 1.10V).
• Frequency range: 1866-10 MHz, with a data rate range per pin of 3733-20Mbp/s.
• 16n prefetch DDR architecture: 8 internal banks per channel for concurrent operation.
• Single-data-rate CMD/ADR entry: Bidirectional/differential data strobe per byte lane.
• Programmable READ and WRITE latencies (RL/WL): Programmable and on-the-fly burst lengths (BL = 16, 32).
• Directed per-bank refresh: For concurrent bank operation and ease of command scheduling.
• Up to 8.53 GB/s per die x16 channel: On-chip temperature sensor to control self-refresh rate.
• Partial-array self-refresh (PASR): Selectable output drive strength (DS).
• Clock-stop capability: RoHS-compliant, “green” packaging.
• Array configuration: 512 Meg x 32 (2 channels x 16 I/O) – 512M32 x 1 die in package.
• FBGA “green” package: 200-ball FBGA (10mm x14.5mm x0.8mm Max), (10mm x14.5mm x0.95mm Max), (10mm x14.5mm x1.02mm Max).
• Operating temperature range: -25°C to +85°C.

Core Specifications:

• Part Number Decoding: RS 512M32 LO4 D1 B DS – 53 BT indicates Rayson Mobile DRAM Memory with a configuration of 512M32 (512 Meg x 32), product family LO4 (LPDDR4X/LPDDR4), 1 die, speed grade 53 (3733Mb/s/pin), and package code DS (200ball FBGA-10*14.5) with operating voltages VDD1 1.80V, VDD2 1.10V, VDDQ 0.60V or 1.10V, and operating temperature BT (-25°C to +85°C).

Physical Specifications:

• Function Block Diagram: Single-Die, Dual-Channel Single-Rank Package Block Diagram.
• Package ballout & Addressing: 200-Ball Dual-Channel, Single-Rank Discrete FBGA.

This product is designed for high-speed data transmission with low power consumption, making it suitable for applications such as smartphones, tablets, laptops, digital set-top boxes, smart TVs, and other smart devices. It offers a wide temperature range and flexible clock frequency support, ensuring reliable performance across various operating conditions.