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Product Details
RS768M32LX4DBNR-53BT 3GB LPDDR4/4X RAYSON
Model: RS768M32LX4D4BNR-53BT
Capacity: 24Gb
Bit wide: x 32
Speed: 3733Mbps
Working voltage: 1.8 / 1.1 / 0.6V
Operation temperature: -25~85℃
Package: FBGA 200
Ultra-low-voltage core and I/O power supplies
– VDD1 = 1.70-1.95V; 1.80V nominal
– VDD2 = 1.06-1.17V; 1.10V nominal
– VDDQ = 0.57-0.65V; 0.60V nominal or VDDQ = 1.06-1.17V; 1.10V nominal
Frequency range
– 1866-10 MHz (data rate range per pin:3733 -20Mbp/s)
16n prefetch DDR architecture
8 internal banks per channel for concurrent operation
Single-data-rate CMD / ADR entry
Bidirectional / differential data strobe per byte lane
Programmable READ and WRITE latencies (RL / WL)
Programmable and on-the-fly burst lengths (BL = 16, 32)
Directed per-bank refresh for concurrent bank operation and ease of command scheduling
Up to 8.53 GB / s per die x16 channel
On-chip temperature sensor to control self refresh rate
Partial-array self refresh (PASR)
Selectable output drive strength (DS)
Clock-stop capability
RoHS-compliant, “green” packaging
VDD1/VDD2/VDDQ: 1.80V/1.10V/0.60V or 1.10V
Array configuration
– 768Meg x 32 (2 channels x 16 I/O)
– 384M16 x 4 die in package
FBGA “green” package
– 200-ball FBGA (10mm x15mm x1.0mm Max)
Speed grade,cycle time
– 535ps@ RL = 32/36
Operating temperature range
– -25°C to + 85°C
Model | RS768M32LX4D4BNR-53BT |
Capacity | 24Gb |
Bit wide | x 32 |
Speed | 3733Mbps |
Working voltage | 1.8 / 1.1 / 0.6V |
Operation temperature | -25~85℃ |
Package | FBGA 200 |
Related applications
flat
Smart TV
mobile phone
Education Electronics
Intelligent Wearing
vehicle
Box
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