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Product Details
W631GG6MB-12 In Stock Winbond 1Gb DDR3 SDRAM memory IC Authorized Winbond Electronic Parts Distributors
Winbond W631GG6MB-12
The W631GG6MB-12 is a 1Gb DDR3 SDRAM memory IC from Winbond Electronics. Here is an overview of its key features and specifications:
1. Density: The W631GG6MB-12 offers 1Gb (Gigabit) of storage, organized as 8,388,608 words x 8 banks x 16 bits.
2. Speed Grades: It is available in various speed grades, including -09, -11, -12, -15, and their industrial (I) and industrial plus (J) temperature range counterparts, which correspond to different DDR3 specifications such as DDR3-2133, DDR3-1866, DDR3-1600, and DDR3-1333.
3. Clock Frequency: The device achieves high-speed transfer rates, with the highest being 2133 MT/s (DDR3-2133).
4. Voltage: It operates with a supply voltage (Vcc) ranging from 1.425V to 1.575V.
5. Current: The working current is 105mA, and the refresh current is 10mA.
6. Temperature Range: The W631GG6MB-12 is available in different temperature ranges, including commercial (C-temp), industrial (I-temp), and automotive grades.
7. Package: The memory IC is packaged in a VFBGA-96 (Very Fine Ball Grid Array) package.
8. Features: Key features include a double data rate architecture for two data transfers per clock cycle, eight internal banks for concurrent operation, an 8-bit prefetch architecture, and various CAS latencies (5, 6, 7, 8, 9, 10, 11, 13, and 14). It also supports burst length 8 (BL8) and burst chop 4 (BC4) modes, programmable read burst ordering, and differential clock inputs (CK and /CK#).
9. Power Management: The W631GG6MB-12 includes features like refresh, self-refresh, auto self-refresh (ASR), and partial array self-refresh (PASR), as well as precharged power down and active power down modes.
10. Data Masks and Calibration: It supports data masks (DM) for write data, programmable CAS write latency (CWL) per operating frequency, and ZQ calibration for output driver and ODT using an external reference resistor to ground.
The W631GG6MB-12 is designed for high-performance applications requiring fast data transfer rates and is suitable for a wide range of electronic devices, including those operating in extreme temperature conditions due to its various temperature grade options.
